2UUL THE MICRO JIG BH04 IC Mini Tempered Insulated Glass Fixture for Mobile Phone Motherboard Repair

2UUL THE MICRO JIG BH04 IC Mini Tempered Insulated Glass Fixture for Mobile Phone Motherboard Repair

The 2UUL Micro Jig BH04 is a high-precision, universal PCB fixture designed specifically for mobile-phone motherboard repair, IC soldering / desoldering, BGA / NAND work, and glue/tin removal tasks. Its adjustable clamp and base design ensures a firm, stable grip on motherboards of various sizes — avoiding movement or rebound even under heavy hot-air or rework conditions.

The fixture’s insulated glass or high-heat-resistant base helps protect the board when working with hot-air guns or soldering irons. With a rotary-shaft locking mechanism and anti-slip pad, it securely locks the board or chip in place. You can adjust the clamp distance (high / middle / low) by loosening the screws, repositioning the fixing plate, and locking again — making it flexible for different board thicknesses and sizes.

Whether you are removing back-glue from chips, cleaning large ICs (CPU, NAND), reballing BGA chips, or doing microsoldering on smartphone motherboards, the 2UUL Micro Jig BH04 gives you the stability, precision, and safety required for professional-level rework.

⭐ Key Features

• Universal fixture for mobile phone motherboards & various PCB sizes
• Adjustable clamp with high/middle/low levels for different board thicknesses
• Rotary-shaft locking mechanism — holds board firmly without rebound or slip
• Heat-resistant glass / insulated base for hot-air / soldering work
• Anti-slip pad / stable base for secure mounting on your workbench
• Supports glue/tin removal from ICs — clamp designed to support empty parts under chips during glue removal
• Compatible with IC removal, BGA reballing, CPU & NAND chip repair, and general PCB maintenance
• Compact and lightweight yet sturdy — suitable for workshop or small bench setups
• Easy to adjust and secure — user-friendly locking and release mechanism
• Provides stable, vibration-free support — essential for precision soldering, hot-air work, and BGA rework
  

  ⚙️ Technical Specifications

  Specification	Detail
  Model	2UUL Micro Jig BH04
  Type	PCB / Motherboard Repair Fixture / Holder / Clamp Stand
  Material / Base	Tempered insulated glass or heat-resistant base (as per listing)
  Adjustable Levels	High / Middle / Low — clamp position adjustable via screws
  Clamping Mechanism	Rotary-shaft locking clamp — no rebound, firm grip
  Compatibility	Mobile phone motherboards, smartphone PCBs, small/medium boards, IC/NAND/CPU chips, BGA/NAND boards
  Use Cases	IC soldering, desoldering, hot-air rework, glue/tin removal, BGA reballing, CPU/NAND repair, general PCB maintenance
  Base Stability	Anti-slip base / pad to prevent movement during rework
  Size / Dimensions	Portable, compact design — standard small PCB fixture size (fits smartphone-class boards)
  Weight (approx.)	Light enough for bench-use, yet sturdy for stable holding