Aixun Z13 4-in-1 Middle Layer Positioning BGA Tin Planting Platform for iPhone 13 Series
Rs.2,998.00
Aixun Z13 4-in-1 BGA Tin Planting Platform provides precise middle-layer positioning for iPhone 13 series motherboard repair, supporting BGA reballing, tin planting, CPU and IC repair applications.
Aixun Z13 4-in-1 Middle Layer Positioning BGA Tin Planting Platform for iPhone 13 Series
The Aixun Z13 4-in-1 Middle Layer Positioning BGA Tin Planting Platform is a precision repair fixture designed for iPhone 13 series motherboard repair, middle-layer positioning, and BGA reballing applications. It provides stable and accurate positioning of motherboard layers during tin planting and component-level repair.
With its 4-in-1 design, the Z13 platform is designed to support multiple iPhone 13 series motherboard configurations, helping technicians improve efficiency when working on layered boards. Its dedicated positioning structure helps keep the motherboard securely aligned during BGA stencil and solder-ball placement operations.
The Aixun Z13 is suitable for professional repair technicians performing CPU, IC, BGA, motherboard separation, reballing, and middle-layer repair. Its stable platform design makes delicate board-level work more controlled and repeatable.
Key Features
- 4-in-1 Repair Platform – Designed to support multiple iPhone 13 series motherboard repair applications.
- Middle Layer Positioning – Provides stable positioning for layered motherboard work.
- BGA Tin Planting Support – Helps technicians perform accurate solder-ball/tin planting operations.
- iPhone 13 Series Compatible – Designed specifically for iPhone 13 series motherboard repair.
- Precision Alignment – Helps maintain accurate board and stencil positioning during reballing.
- Stable Motherboard Holding – Reduces unwanted movement while working on delicate components.
- BGA Reballing Tool – Suitable for CPU, IC and other BGA component repair workflows.
- Layered Board Repair – Useful for technicians working on separated or stacked motherboard layers.
- Professional Repair Fixture – Ideal for mobile phone motherboard repair workshops.
- Reusable Design – Suitable for repeated board-level repair and reballing applications.
Technical Specifications
| Specification | Details |
|---|---|
| Brand | Aixun |
| Model | Z13 |
| Product Type | 4-in-1 BGA Tin Planting Platform |
| Design | Middle Layer Positioning Platform |
| Compatibility | iPhone 13 Series |
| Application | Motherboard Repair & BGA Reballing |
| Function | Middle Layer Positioning & Tin Planting |
| Suitable For | CPU, IC & BGA Component Repair |
| Board Type | Layered Motherboard |
| Usage | Professional Mobile Phone Repair |
| Weight | 0.50 kg |
|---|---|
| Dimensions | 12 × 10 × 4 cm |
