Amaoe AU-4 Stencil for iPhone CPU

The Amaoe AU-4 Stencil for iPhone CPU is a professional-grade BGA reballing stencil engineered for precise CPU chip repair and motherboard rework. Designed specifically for iPhone CPU IC layouts, this stencil ensures accurate solder ball placement and uniform alignment during reballing and chip replacement procedures.

Manufactured from premium stainless steel using advanced laser-cut technology, the AU-4 stencil delivers exceptional durability, heat resistance, and long-lasting performance. It helps minimize solder bridging, improves joint reliability, and enhances repair success rates in complex board-level servicing.

Perfect for professional mobile technicians and advanced repair workshops, the Amaoe AU-4 stencil supports efficient workflow, cleaner soldering results, and consistent high-quality repairs.

Key Features:

• Designed for iPhone CPU BGA reballing and IC repair
• Precision laser-cut stainless steel construction
• Ensures uniform solder ball distribution
• Reduces solder bridging and short circuit risks
• Heat-resistant for hot air and reflow soldering
• Durable, anti-rust, and reusable design
• Improves solder joint strength and electrical connectivity
• Lightweight and easy PCB alignment
• Suitable for advanced board-level repairs
• Ideal for professional mobile repair technicians

Technical Specifications:

• Brand: Amaoe
• Model: AU-4
• Material: Premium stainless steel
• Application: iPhone CPU BGA reballing
• Thickness: Approx. 0.12 mm – 0.15 mm
• Precision Tolerance: ±0.01 mm
• Surface Finish: Anti-corrosion metallic coating
• Reusable: Yes
• Weight: Approx. 10–20 g
• Compatibility: iPhone motherboard CPU IC chips