Amaoe K3P-012 Stencil

Amaoe K3P-012 Stencil for Xiaomi Mi K30 Pro Middle Layer Motherboard Reballing

The Amaoe K3P-012 Stencil is a precision middle layer motherboard reballing stencil designed specifically for the Xiaomi Mi K30 Pro smartphone. This professional repair tool allows technicians to accurately rebuild solder points on the middle layer motherboard structure, ensuring stable connections and reliable device performance after repair.

Made from premium stainless steel with high-precision laser cutting, the stencil provides perfectly aligned hole patterns that help technicians perform accurate solder ball placement during reballing procedures. Its ultra-thin design improves heat distribution during soldering, allowing for clean and consistent reballing results while reducing the risk of solder bridging.

The Amaoe K3P-012 reballing stencil is specially designed for Mi K30 Pro middle-layer motherboard repair, making it an essential tool for technicians performing stacked motherboard repairs and advanced chip-level maintenance. The durable stainless steel construction ensures long-term reliability and repeated use in professional repair environments.

Ideal for mobile repair technicians, GSM service centers, and electronics repair labs, the Amaoe stencil provides the accuracy and durability required for modern multi-layer smartphone motherboard repairs.

Key Features

• Designed for Xiaomi Mi K30 Pro middle layer motherboard reballing
• High-precision laser-cut stencil for accurate solder placement
• Made from premium stainless steel for durability
• Ultra-thin design for better heat transfer during soldering
• Ensures precise alignment of middle layer motherboard pads
• Helps prevent solder bridging and repair errors
• Ideal for stacked motherboard repair and chip-level maintenance
• Reusable professional reballing stencil
• Suitable for micro-soldering and PCB repair work
• Trusted Amaoe professional repair tool quality

Technical Specifications