Amaoe MQ-4 Stencil for MTK Qualcomm CPU

Amaoe MQ-4 Stencil for MTK Qualcomm CPU

The Amaoe MQ-4 Stencil for MTK / Qualcomm CPU is a high-precision BGA reballing stencil engineered for CPU chip repair and advanced motherboard rework. Designed to support both MediaTek (MTK) and Qualcomm CPU layouts, this stencil ensures accurate solder ball placement and perfect alignment during reballing and chip replacement procedures.

Manufactured from premium-grade stainless steel using advanced laser-cut technology, the MQ-4 stencil delivers exceptional durability, heat resistance, and long-term performance. It minimizes solder bridging, improves solder joint strength, and enhances overall repair reliability in complex board-level repairs.

Ideal for professional mobile repair technicians and service centers, the Amaoe MQ-4 stencil improves workflow efficiency and ensures consistent, high-quality CPU reballing results.

Key Features:

• Designed for MTK & Qualcomm CPU BGA reballing
• Precision laser-cut stainless steel construction
• Ensures uniform solder ball alignment
• Reduces solder bridging and short circuit risks
• High heat resistance for hot air and reflow soldering
• Durable, anti-rust, and reusable design
• Enhances solder joint reliability and conductivity
• Lightweight and easy PCB positioning
• Suitable for advanced motherboard repair tasks
• Ideal for professional mobile repair workshops

Technical Specifications:

• Brand: Amaoe
• Model: MQ-4
• Material: Premium stainless steel
• Application: MTK / Qualcomm CPU BGA reballing
• Thickness: Approx. 0.12 mm – 0.15 mm
• Precision Tolerance: ±0.01 mm
• Surface Finish: Anti-corrosion metallic coating
• Reusable: Yes
• Weight: Approx. 10–20 g
• Compatibility: MTK and Qualcomm CPU IC chip layouts (model-specific design)