Amaoe MZ-6 Stencil

The Amaoe MZ-6 Stencil is a professional-grade BGA reballing stencil designed for precise IC chip repair and advanced motherboard rework. Crafted from premium stainless steel with high-accuracy laser cutting, this stencil ensures perfect solder ball alignment and consistent paste distribution during reballing procedures.

Built for professional technicians and repair workshops, the MZ-6 stencil minimizes solder bridging, enhances solder joint strength, and improves overall repair success rates. Its heat-resistant and anti-corrosion construction allows repeated use under hot air stations and reflow systems without warping or damage.

Whether you are performing chip replacement, CPU repair, or detailed PCB rework, the Amaoe MZ-6 stencil delivers clean, accurate, and professional-level results every time.

Key Features:

• Precision laser-cut stainless steel construction
• Designed for accurate BGA IC reballing
• Ensures uniform solder ball placement
• Reduces solder bridging and alignment errors
• High heat resistance for hot air and reflow use
• Durable, anti-rust, and reusable design
• Improves electrical connectivity and joint strength
• Lightweight and easy to align on PCB
• Suitable for advanced motherboard repair tasks
• Ideal for professional mobile repair technicians

Technical Specifications:

• Brand: Amaoe
• Model: MZ-6
• Material: Premium stainless steel
• Application: BGA IC reballing and motherboard repair
• Thickness: Approx. 0.12 mm – 0.15 mm
• Precision Tolerance: ±0.01 mm
• Surface Finish: Anti-corrosion metallic coating
• Reusable: Yes
• Weight: Approx. 10–20 g
• Compatibility: Various BGA IC chip layouts (model-specific)