Amaoe OV-6 Stencil for Oppo/Vivo

The Amaoe OV-6 Stencil for Oppo/Vivo is a professional-grade BGA reballing stencil engineered for precise motherboard repair and IC chip servicing. Designed specifically for Oppo and Vivo smartphone models, this stencil ensures accurate solder ball placement and perfect alignment during chip rework and replacement procedures.

Manufactured using high-quality stainless steel with advanced laser-cut technology, the OV-6 stencil delivers exceptional precision and durability. It minimizes solder bridging, improves solder joint strength, and enhances overall repair reliability. Ideal for CPU, power IC, and other BGA component reballing, this stencil is suitable for use with hot air stations and reflow machines.

Built for professional mobile repair technicians, the Amaoe OV-6 stencil helps increase efficiency, reduce repair errors, and deliver consistent high-quality results in every job.

Key Features:

• Specially designed for Oppo & Vivo BGA IC reballing
• Precision laser-cut stainless steel construction
• Ensures uniform solder ball distribution
• Reduces solder bridging and short circuits
• Heat-resistant and corrosion-proof design
• Reusable and easy to clean after use
• Improves alignment accuracy during IC replacement
• Lightweight and easy PCB positioning
• Suitable for hot air and reflow soldering
• Ideal for professional mobile repair workshops

Technical Specifications:

• Brand: Amaoe
• Model: OV-6
• Material: Premium stainless steel
• Application: Oppo & Vivo BGA IC reballing
• Thickness: Approx. 0.12 mm – 0.15 mm
• Precision Tolerance: ±0.01 mm
• Surface Finish: Anti-rust metallic coating
• Reusable: Yes
• Weight: Approx. 10–20 g
• Compatibility: Oppo and Vivo smartphone motherboard BGA chips