AMAOE QU-6 Stencil for Qualcomm CPU

AMAOE QU-6 Stencil for Qualcomm CPU – Professional BGA Reballing Tool

The AMAOE QU-6 Stencil for Qualcomm CPU is engineered for professional mobile repair technicians who perform advanced CPU reballing and IC replacement tasks. Designed specifically for Qualcomm processors, this stencil ensures precise solder ball alignment and consistent reballing performance.

Crafted from premium-grade stainless steel, the QU-6 stencil offers superior heat resistance and long-lasting durability for repeated workshop use. Its precision laser-cut hole pattern enables uniform solder ball placement, reducing bridging, short circuits, and costly repair errors.

Ideal for motherboard rework, CPU reballing, and chip-level servicing, the AMAOE QU-6 stencil improves repair accuracy and delivers clean, reliable results in professional service centers.

Key Features:

• High-precision laser-cut BGA stencil
• Designed for Qualcomm CPU IC reballing
• Premium stainless steel construction
• Accurate solder ball positioning
• Heat resistant and reusable design
• Smooth surface for easy cleaning
• Minimizes solder bridging and alignment errors
• Professional-grade chip-level repair tool

Technical Specifications:

• Brand: AMAOE
• Model: QU-6
• Compatibility: Qualcomm CPU IC chips
• Material: High-quality stainless steel
• Type: BGA Reballing Stencil
• Manufacturing Technology: Precision laser cutting
• Application: CPU IC reballing
• Usage: Mobile motherboard repair