Amaoe SAM-7 Stencil for S9 S9+

Amaoe SAM-7 Stencil for S9 / S9+ – Professional BGA Reballing Tool

The Amaoe SAM-7 Stencil for S9 S9+ is specially engineered for professional mobile repair technicians performing advanced chip-level repairs. Designed for Samsung Galaxy S9 and S9+ motherboards, this stencil ensures precise solder ball alignment for CPU, eMMC, and power IC reballing.

Constructed from premium-grade stainless steel, the SAM-7 stencil offers excellent heat resistance and durability for repeated workshop use. Its precision laser-cut hole pattern guarantees uniform solder placement, reducing bridging and improving overall repair accuracy.

Perfect for motherboard rework and IC replacement, the Amaoe SAM-7 stencil enhances efficiency while delivering clean, consistent, and professional reballing results.

Key Features:

• High-precision laser-cut BGA stencil
• Compatible with Samsung Galaxy S9 & S9+
• Durable stainless steel construction
• Accurate solder ball positioning
• Heat resistant and reusable design
• Smooth surface for easy cleaning
• Reduces soldering errors and short circuits
• Ideal for professional chip-level repair

Technical Specifications:

• Brand: Amaoe
• Model: SAM-7
• Compatibility: Samsung Galaxy S9, S9+
• Material: Premium stainless steel
• Type: BGA Reballing Stencil
• Manufacturing Technology: Precision laser cutting
• Application: CPU, eMMC & IC chip reballing
• Usage: Mobile motherboard repair