Amaoe U-QSD1 Stencil

The Amaoe U-QSD1 Stencil is a high-precision BGA reballing stencil designed for professional mobile technicians working on Qualcomm CPU and IC chip repairs. This stencil is widely used for accurate reballing of smartphone motherboard chips, ensuring reliable soldering and long-lasting repair results.

Manufactured with premium-grade stainless steel and precision laser cutting technology, the stencil delivers perfect hole alignment for solder balls, allowing technicians to perform clean and efficient reballing without solder bridging or misalignment.

The Amaoe U-QSD1 is engineered to withstand high soldering temperatures while maintaining its shape and accuracy. Its ultra-thin design ensures easy chip placement and improved solder ball formation, making it an essential tool for professional GSM repair workshops.

Whether you are repairing Qualcomm-based smartphones, replacing IC chips, or performing motherboard-level repairs, the Amaoe U-QSD1 stencil provides the accuracy and durability required for professional repair work.

Key Features

• Professional BGA reballing stencil for Qualcomm CPU chips
• Precision laser-cut holes for accurate solder ball placement
• Made from high-quality stainless steel
• Ultra-thin and durable design
• Suitable for CPU, PMIC, and IC chip reballing
• High temperature resistance during soldering
• Reduces solder bridging and alignment errors
• Ensures clean and precise reballing results
• Reusable and long-lasting repair tool
• Perfect for professional smartphone motherboard repair

Technical Specifications

• Product Name: Amaoe U-QSD1 Stencil
• Brand: Amaoe
• Model: U-QSD1
• Material: Premium Stainless Steel
• Type: BGA Reballing Stencil
• Manufacturing: Precision Laser Cutting
• Compatibility: Qualcomm CPU / IC Chips
• Application: Smartphone Motherboard Repair
• Heat Resistance: High Temperature Resistant
• Usage: Professional GSM Repair Work