AMAOE U-QSD5 STENCIL

The Amaoe U-QSD5 Stencil is a high-precision BGA reballing stencil designed for repairing Qualcomm chipset power IC and CPU-related components on smartphone motherboards. Built from durable stainless steel with precision laser-cut holes, this stencil allows technicians to accurately place solder balls during chip-level repair and reballing processes.

It is widely used by professional GSM repair technicians to restore faulty Qualcomm PMIC and processor circuits on Android smartphones. The stencil features an optimized aperture design that ensures controlled solder paste distribution and accurate alignment with chip pads, helping prevent solder bridging and improving repair success rates.

With its reusable design and strong heat resistance, the Amaoe U-QSD5 stencil is a reliable tool for advanced mobile motherboard repair and BGA chip rework, making it an essential addition to any professional mobile repair toolkit.

Key Features

• Designed for Qualcomm CPU / PMIC chip reballing
• Precision laser-cut apertures for accurate solder ball placement
• Made from high-quality stainless steel for durability
• Ensures uniform solder paste and solder ball distribution
• 0.12mm optimized thickness for accurate reballing
• Excellent heat resistance for high-temperature soldering
• Helps reduce solder bridging and alignment errors
• Reusable professional repair stencil
• Suitable for advanced smartphone motherboard repairs
• Ideal for GSM technicians and mobile repair labs

Technical Specifications

• Product Name: Amaoe U-QSD5 Stencil
• Brand: Amaoe
• Model: U-QSD5
• Material: Stainless Steel / Japanese Steel Sheet
• Thickness: 0.12
• Hole Type: Precision Square Laser Cut
• Type: BGA Reballing Stencil
• Application: Smartphone CPU / PMIC Reballing
• Supported Chips: PM670A, SDR660, PM670, PM6150, PM6150L, SM6125, SDM636, SDM660, SM6150, SDM670, SDM710
• Reusability: Yes
• Weight: Approx. 10g