Amaoe X-015 iPhone X Stencil

Amaoe X-015 Stencil for iPhone X Middle Layer Motherboard Reballing

The Amaoe X-015 Stencil for iPhone X is a professional BGA reballing stencil designed specifically for repairing the middle layer motherboard of the iPhone X. This high-precision stencil allows technicians to perform accurate solder ball placement and chip alignment during advanced motherboard repair procedures.

Manufactured using premium stainless steel and precision laser cutting technology, the stencil provides perfectly aligned holes for consistent solder ball formation. Its ultra-thin construction ensures efficient heat transfer during the soldering process, helping technicians achieve clean and reliable solder joints while minimizing solder bridging or misalignment.

The Amaoe X-015 stencil is widely used by professional mobile repair technicians for CPU, IC chip reballing, and middle layer motherboard restoration in iPhone X devices. Its durable and reusable design ensures long-term performance in demanding repair environments such as GSM repair labs and electronics service centers.

With its precise layout and reliable build quality, the Amaoe X-015 stencil helps technicians complete accurate and efficient iPhone motherboard reballing repairs.

Key Features

• Specially designed for iPhone X middle layer motherboard reballing
• High-precision laser-cut holes for accurate solder ball placement
• Made from premium stainless steel for durability
• Ultra-thin design for efficient heat transfer during soldering
• Ensures precise IC and CPU chip alignment
• Reduces solder bridging and improves repair accuracy
• Reusable professional repair stencil
• Ideal for micro-soldering and chip-level repairs
• Lightweight and easy to handle during repair work
• Trusted Amaoe professional repair tool quality

Technical Specifications