Amaoe X7P+ Vivo X70 Pro Plus Stencil

Amaoe X7P+ Stencil for Vivo X70 Pro Plus Middle Layer Motherboard Reballing

The Amaoe X7P+ Stencil for Vivo X70 Pro Plus is a professional BGA reballing stencil designed for repairing the middle layer motherboard of the Vivo X70 Pro Plus smartphone. This precision-engineered stencil helps technicians perform accurate solder ball placement and chip alignment during complex motherboard reballing procedures.

Manufactured from high-quality stainless steel with precision laser-cut technology, the stencil ensures perfectly aligned holes that allow uniform solder ball formation. The ultra-thin design improves heat transfer during the soldering process, enabling technicians to achieve clean and reliable solder joints while minimizing the chances of solder bridging or chip misalignment.

The Amaoe X7P+ stencil is ideal for CPU, IC chip reballing, and middle layer motherboard restoration in Vivo X70 Pro Plus devices. Its durable and reusable construction ensures long-term reliability for professional mobile repair technicians, GSM repair labs, and electronics repair centers.

With Amaoe’s trusted precision and quality, this stencil helps technicians complete efficient and accurate smartphone motherboard repairs.

Key Features

• Designed for Vivo X70 Pro Plus middle layer motherboard reballing
• High-precision laser-cut holes for accurate solder ball placement
• Made from premium stainless steel for durability
• Ultra-thin design for efficient heat transfer during soldering
• Ensures precise CPU and IC chip alignment during repair
• Reduces solder bridging and improves repair accuracy
• Reusable professional BGA reballing stencil
• Ideal for micro-soldering and chip-level smartphone repairs
• Lightweight and easy to handle for technicians
• Trusted Amaoe professional repair tool quality

Technical Specifications