JTX SM-01 Swap Board BGA Reballing Stencil Platform
The JTX SM-01 Swap Board Chips BGA Reballing Stencil Platform Set is a professional repair tool designed for accurate chip reballing and motherboard swap repairs for iPhone 8 to iPhone 16 Pro Max. This advanced stencil platform allows technicians to perform precise BGA chip reballing, CPU swaps, NAND repair, and motherboard-level maintenance with improved stability and efficiency.
Engineered with high-precision alignment and durable metal construction, the JTX SM-01 platform ensures accurate positioning of BGA chips during solder ball placement and heating. The platform is designed to work seamlessly with various reballing stencils, helping repair professionals achieve reliable solder joints and minimize repair errors.
The SM-01 Swap Board Platform Set is widely used in professional mobile repair labs and service centers for advanced motherboard repairs, including IC reballing, chip replacement, and board-level troubleshooting. Its stable design improves work accuracy while protecting delicate components during the reballing process.
Compatible with multiple iPhone models from iPhone 8 series up to iPhone 16 Pro Max, this versatile repair platform is an essential tool for technicians performing high-level microsoldering and BGA repair work.
Key Features
- Professional BGA reballing stencil platform for iPhone motherboard repair
- Designed for iPhone 8 to iPhone 16 Pro Max chip swap and repair
- High precision alignment system for accurate chip positioning
- Durable metal platform for stable reballing operations
- Supports CPU, NAND, and IC reballing processes
- Compatible with various BGA reballing stencils
- Improves accuracy during chip swap and motherboard repair
- Ideal for professional microsoldering technicians
- Reduces soldering errors and improves repair efficiency
- Widely used in mobile repair labs and service centers
Technical Specifications
- Brand: JTX
- Model: SM-01
- Product Type: BGA Reballing Stencil Platform Set
- Application: iPhone motherboard chip reballing and swap repair
- Compatible Devices: iPhone 8 – iPhone 16 Pro Max
- Material: High-precision metal platform
- Function: CPU / NAND / IC reballing and chip alignment
- Usage: Mobile motherboard repair and microsoldering
- Design: Stable platform with accurate positioning
- Target Users: Professional repair technicians
| Weight | 0.100 kg |
|---|---|
| Dimensions | 20 × 18 × 15 cm |
