JTX T4 Max Universal Chips Glue Removal Platform Set

JTX T4 Max Universal Chips Glue Removal & Tin Planting Platform Set for iPhone, Samsung, HiSilicon & Android RAM

The JTX T4 Max Universal Chips Glue Removal and Tin Planting Platform Set is a professional chip-level repair solution designed for IC glue removal, BGA reballing, solder ball planting, and RAM/CPU chip maintenance. Engineered for advanced motherboard repair, this versatile platform is compatible with iPhone, Samsung, HiSilicon, Qualcomm, MediaTek, and other Android chipset platforms, making it an essential tool for professional mobile phone repair technicians.

Constructed from high-precision CNC-machined aluminum alloy, the JTX T4 Max securely holds IC chips during glue removal and reballing operations. The stable clamping mechanism minimizes chip movement, allowing technicians to remove underfill adhesive, clean IC surfaces, and accurately plant solder balls with greater precision and efficiency.

Its universal design supports a wide range of CPU, RAM, NAND Flash, EEPROM, PMIC, and BGA IC packages used in smartphones and tablets. The precision alignment system helps maintain correct chip positioning throughout the repair process, improving solder ball consistency and reducing the risk of misalignment during reinstallation.

Designed for long-term professional use, the JTX T4 Max offers excellent heat resistance, corrosion resistance, and machining accuracy. Whether you’re performing motherboard refurbishment, CPU reballing, RAM replacement, or chip-level diagnostics, this platform delivers the stability and precision required for successful repairs.

Key Features

• Universal IC glue removal and tin planting platform.
• Compatible with iPhone, Samsung, HiSilicon, Qualcomm, MediaTek, and Android chipsets.
• Suitable for CPU, RAM, NAND, EEPROM, PMIC, and BGA IC reballing.
• CNC-machined aluminum alloy construction for maximum durability.
• Precision chip positioning for accurate solder ball planting.
• Secure clamping system minimizes chip movement during repair.
• Excellent heat resistance for professional soldering applications.
• Improves efficiency during glue removal and motherboard restoration.
• Compact and lightweight design for easy workshop use.
• Ideal for professional chip-level motherboard repair technicians.

Technical Specifications