Description

Luowei HS3 Uniform Preheat Platform for Motherboard Chip BGA Repair

Features:

• Uniform heating, no hot air gun required, no soldering iron required
• Aerospace aluminum alloy plate, efficient heating coverage, reduces energy consumption, broad application range
• Compact and portable, compact size, powerful performance precise temperature control
• Maximum power 99W, PD power delivery, more rapid heating
• Light interactivity, simple operation, and color changes reflect the device’s status
• preheat platform, tinning, degumming, laminating, temperature control, vibrant light interaction, safe and constant temperature
• Infinite control knob, simple operation, one-touch adjustment
• The heating area eliminates excess and enhances efficiency and precise heating, 65mm×100mm fits various sizes of smartphone motherboards

Package includes:

• 1 x Platform