MaAnt M072 BGA Reballing Platform

MaAnt M072 Integrated Tin Planting BGA Reballing Platform Set (iPhone X–16 Pro Max)

The MaAnt M072 Integrated Tin Planting BGA Reballing Platform is a professional-grade solution designed for accurate CPU, NAND, and IC chip reballing on iPhone motherboards. This 19-in-1 integrated platform supports a wide range of models from iPhone X to 16 Pro Max, eliminating the need for multiple fixtures.

Engineered with a high-strength magnetic positioning system, it ensures stable motherboard placement and precise alignment during solder ball planting. The platform includes multi-model positioning plates and high-quality steel stencils, enabling technicians to perform consistent and efficient BGA rework operations.

Built from durable CNC-machined materials, the MaAnt M072 offers excellent heat resistance, long-term durability, and high precision, making it ideal for professional repair labs and advanced technicians handling complex motherboard repairs.

Key Features

• 19-in-1 integrated platform for multiple iPhone models
• Supports iPhone X to 16 Pro Max series
• Strong N50 magnetic positioning system for stability
• High-precision alignment for accurate solder ball placement
• Includes multiple positioning plates and steel stencils
• CNC-machined durable construction
• Heat-resistant and deformation-free design
• Improves efficiency and reballing success rate
• No need to frequently replace base fixtures
• Ideal for CPU, NAND, IC and BGA repair

Technical Specifications

• Brand: MaAnt
• Model: M072
• Type: Integrated BGA reballing platform
• Compatibility: iPhone X to 16 Pro Max
• Function: Tin planting, IC reballing, motherboard repair
• Magnetic System: Multi-directional N50 strong magnets
• Material: CNC aluminum alloy + steel mesh
• Design: Multi-model expansion base
• Included Components:
  • 1 × Base
  • 4 × Positioning plates
  • 14 × Steel stencils
• Application: CPU, NAND, BGA chip repair
• Usage: Professional mobile motherboard repair