MAANT MY-2015 Desolder Wire

Rs.210.00

The MAANT MY-2015 Desolder Wire is a wide copper solder wick designed for fast and efficient solder removal in PCB and mobile repair tasks.

MAANT MY-2015 Desolder Wire (Wide Copper Solder Wick for Fast PCB Solder Removal)

The MAANT MY-2015 Desolder Wire is a high-efficiency solder wick designed for fast and reliable solder removal in professional electronics and mobile repair. Built with high-purity braided copper, it offers superior heat transfer and powerful capillary action, making it ideal for quickly absorbing large amounts of molten solder.

Featuring a low-residue flux coating, the MY-2015 ensures clean desoldering with minimal residue, reducing the need for post-cleaning. Its wider braid design makes it perfect for handling larger solder joints, grounding points, and power lines on PCBs, while still maintaining precision and safety.

The flexible and durable structure allows easy handling during BGA rework, SMD repair, and motherboard maintenance, ensuring that PCB pads and components remain undamaged. It is especially useful for technicians dealing with heavy solder removal tasks and high-density circuit boards.

Whether you’re working in a professional repair lab or performing advanced DIY repairs, the MAANT MY-2015 Desolder Wire is an essential tool for achieving quick, clean, and efficient desoldering results.


Key Features

  • Wide desolder wire for high-efficiency solder removal
  • Made from high-purity copper braid
  • Strong capillary action for fast absorption
  • Low-residue flux coating for cleaner results
  • Ideal for large solder joints and PCB grounding points
  • Suitable for BGA, SMD, and motherboard repair
  • Flexible and easy to handle
  • Prevents damage to PCB pads and components
  • Improves speed and efficiency of repair work
  • Durable and reliable performance

Technical Specifications

SpecificationDetails
Product NameMAANT MY-2015 Desolder Wire
BrandMAANT
ModelMY-2015
TypeSolder Wick / Desolder Braid
MaterialHigh-Purity Copper
CoatingLow-Residue Flux
FunctionHigh-Efficiency Solder Removal
ApplicationPCB, BGA, SMD & IC Repair
FlexibilityHigh
UsageElectronics Repair & Maintenance

 

Weight0.20 kg
Dimensions15 × 12 × 10 cm