MAXX PAMMA MX-426C Flux Paste

Rs.115.00

MAXX PAMMA MX-426C Flux Paste is a professional low-residue soldering flux designed for BGA, SMD, PCB, and mobile motherboard repair with smooth solder flow.

Out of stock

MAXX PAMMA MX-426C Flux Paste – Professional Low-Residue Soldering Flux for BGA, PCB & Mobile Motherboard Repair

The MAXX PAMMA MX-426C Flux Paste is a high-performance professional soldering solution engineered for mobile repair technicians, BGA specialists, PCB engineers, and electronics repair professionals. Designed to improve solder flow, enhance joint strength, and reduce oxidation during precision soldering, MX-426C is ideal for motherboard repair, chip reballing, SMD rework, CPU/IC soldering, and advanced GSM servicing.

Built for demanding microsoldering environments, this premium flux paste offers smooth tinning performance, strong wetting capability, and low-residue formulation to help technicians achieve cleaner, more reliable solder joints. Whether you are repairing smartphone motherboards, reballing BGA chips, or handling precision PCB tasks, the MX-426C improves solder efficiency while minimizing corrosion and post-repair cleaning effort.

Key Features

  • Professional Low-Residue Formula: Cleaner soldering with reduced post-repair cleanup
  • Excellent Solder Flow Performance: Improves tin spread and joint consistency
  • Anti-Oxidation Protection: Reduces oxidation during high-temperature soldering
  • Ideal for BGA & SMD Rework: Suitable for CPU, IC, NAND, PCB, and motherboard repair
  • Smooth Wetting Ability: Enhances solder adhesion on delicate points
  • Stable High-Temperature Performance: Reliable under rework station and soldering iron use
  • Non-Corrosive Repair Grade: Designed for precision electronics applications
  • Versatile Professional Use: Perfect for GSM repair labs and electronics workshops

Technical Specifications

  • Brand: MAXX PAMMA
  • Model: MX-426C
  • Product Type: Flux Paste / Soldering Flux
  • Formula Type: Low residue, anti-oxidation
  • Primary Applications: BGA reballing, SMD soldering, PCB repair, motherboard servicing
  • Compatibility: Smartphones, tablets, laptops, IC chips, CPU, NAND, PCB boards
  • Usage Environment: Soldering iron, hot air station, BGA rework station
  • Residue Level: Low residue
  • Repair Scope: Mobile repair, electronics servicing, chip-level rework
  • Target Users: GSM technicians, PCB engineers, microsoldering specialists
Weight0.020 kg
Dimensions10 × 4 × 4 cm