MECHANIC Dr.X Desoldering Wire

MECHANIC Dr.X Desoldering Wire – Super Strong No-Residue Solder Wick for Precision Repair

MECHANIC Dr.X Desoldering Wire is engineered for technicians who need powerful solder absorption, cleaner results, and reliable desoldering during electronics repair. Designed with 99.9% pure copper and advanced braid technology, this premium solder wick increases solder absorption efficiency by 35%, making component removal faster and safer.

Its no-residue formula minimizes board contamination while ensuring clean solder joints, ideal for mobile phone motherboard repair, PCB correction, IC replacement, and BGA rework. Available in multiple width sizes, the Dr.X desoldering wire provides precision across delicate micro-soldering and larger solder pad applications.

Key Features:

• Super strong solder absorption for rapid desoldering
• 35% improved absorption efficiency for faster solder removal
• Made with 99.9% high-purity oxygen-free copper
• No-residue formula keeps PCB clean after use
• Suitable for PCB, BGA, IC, CPU, and SMD repair
• Precision woven braid for efficient heat transfer
• Reduces solder bridge risk during motherboard repair
• Available in multiple widths for various repair needs
• Easy-to-use spool design for technician convenience
• Professional-grade quality for electronics repair shops

Technical Specifications:

• Product Name: MECHANIC Dr.X Desoldering Wire
• Model: Dr.X
• Material: 99.9% Pure Copper
• Length: 1.5 meters
• Width Options: 1.5mm / 2.0mm / 2.5mm / 3.0mm / 3.5mm
• Net Weight: 29g
• Quantity: 20 pieces per box
• Packaging Size: 265 × 80 × 142mm
• Gross Weight: 676g
• Feature: No Residue, Fast Absorption
• Application: PCB Repair, Mobile Repair, BGA Rework, Solder Removal