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Mechanic iBGA 13 Max 14-IN-1 Motherboard Middle Layer Reballing Platform FOR iPhone X To 13 Pro Max

Rs.2,498.00 Rs.3,000.00

Mechanic iBGA 13 Max 14-IN-1 Motherboard Middle Layer Reballing Platform FOR iPhone X To 13 Pro Max

Description

[vc_row css=”.vc_custom_1611847391626{margin-bottom: 20px !important;}”][vc_column][vc_column_text]MECHANIC IBGA13 MAX 14 in 1 Middle Frame Reballing Platform Motherboard Fixture with Stencil For iPhone X – 13 Pro Max Mini,Mechanic Middle Layer Tin Planting Platform iBGA13 MAX for iPhone X/XS/XS Max/11/11 Pro/11 Pro max/12/12 mini/12 Pro/12 Pro max/13/13 mini/13 Pro/13 Pro Max Tin planting steel mesh positioning plate.

MECHANIC iBGA13 MAX Middle Layer Positioning Tin Planting Platform Stencil Suit Support for iPhone X/XS/XS Max/11/11 Pro/11 Pro max/12/12 mini/12 Pro/12 Pro max/13/13 mini/13 Pro/13 Pro Max Motherboard.

Features:

  • Double-sided positioning – single module realizes the middle-layer tin planting of X-13 system.
  • Strong magnetic adsorption – no displacement during the tin planting process.
  • Special grade steel mesh-mesh precision tin planting Wulian tin.
  • High temperature base – high temperature operation does not change shape, quality assurance!

Package Contains:

  • 2x Reballing Platform
  • 7x Stencils

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Additional information

Weight 0.5 kg
Dimensions 15 × 10 × 10 cm