MECHANIC ICING SD360 MAX SOLDER FLUX PASTE

Rs.415.00

The MECHANIC ICING SD360 MAX Solder Flux Paste is a high-performance soldering flux designed for BGA reballing, micro-soldering and professional motherboard repair with clean, reliable results.

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MECHANIC ICING SD360 MAX SOLDER FLUX PASTE

The MECHANIC ICING SD360 MAX Solder Flux Paste is a premium-grade flux formulated to meet the demands of advanced electronics repair and precision soldering. Designed for BGA reballing, IC replacement and fine-pitch PCB work, this flux ensures excellent solder wetting, smooth flow and strong joint formation.

Its optimized “icing-type” consistency provides controlled application, preventing excessive spreading while allowing deep penetration under chips and components. The high-activity formula effectively removes oxidation, improves solder adhesion and enhances conductivity, even during high-temperature hot air rework processes.

With its low-residue composition, SD360 MAX minimizes post-repair cleaning and leaves boards neat and professional. Whether you’re repairing smartphone motherboards, laptop logic boards, gaming consoles or other compact electronics, this solder flux paste improves precision, efficiency and overall repair reliability.

Ideal for professional technicians and serious DIY repair specialists, the MECHANIC ICING SD360 MAX delivers stable performance in demanding workshop environments.


⭐ Key Features

  • High-activity solder flux for BGA and IC rework
  • Icing-type paste consistency for precise control
  • Excellent solder wetting and smooth flow
  • Low residue, easy cleaning after rework
  • Strong anti-oxidation performance
  • Suitable for hot air and soldering iron use
  • Enhances solder joint strength and reliability
  • Ideal for micro-soldering and fine-pitch components
  • Stable under high-temperature applications
  • Designed for professional electronics repair

📐 Technical Specifications

SpecificationDetails
Product NameMECHANIC ICING SD360 MAX Solder Flux Paste
TypeBGA / PCB Soldering Flux
ConsistencyIcing-type medium viscosity paste
Activity LevelHigh activity
ResidueLow residue
ApplicationBGA reballing, IC repair, PCB soldering
CompatibilitySmartphones, laptops, tablets, motherboards
Temperature ResistanceSuitable for hot air rework & soldering iron
CleaningMinimal cleaning required
User LevelProfessional & advanced DIY
Weight0.020 kg
Dimensions15 × 10 × 8 cm