Mechanic iX5 Ultra Universal Preheating Platform For iPhone X-15 Pro Max

Rs.1,740.00

The Mechanic IX5 Ultra Universal Preheating Platform delivers safe, uniform heating up to 260 °C for mobile smartphone motherboard repair, OCA adhesive removal and layered PCB servicing.

Mechanic iX5 Ultra Universal Preheating Platform For iPhone X-15 Pro Max

Upgrade your mobile-repair workstation with the Mechanic IX5 Ultra Universal Preheating Platform — specifically engineered for smartphone motherboard delamination, re-balling, OCA/adhesive removal, and precision PCB tasks. With a preheating temperature range from 20 °C to 260 °C, this platform provides consistent, uniform heat to safely loosen glue and layered motherboards without the need for a hot-air gun or soldering iron.

Designed to support a broad variety of device boards — from the latest iPhone and flagship Android motherboards to smaller repair jobs involving dot-matrix or layered component structures — the IX5 Ultra delivers reliable results every time. Its compact form factor (approximately 80×80×57.6 mm) and dual voltage support (110 V/220 V) make it flexible for global use.

Equipped with a high-quality aluminum alloy heating bed, it offers swift ramp-up and stable maintenance of temperature, ensuring you can work confidently without overheating or thermal shock. Whether you’re prepping a board for re-flow or removing bonding glue, this platform makes your workflow faster, safer, and more efficient.


Key Features

  • Preheating temperature range: 20 °C to 260 °C — ideal for smartphone-level repair tasks.
  • Compact size: 80 × 80 × 57.6 mm, lightweight and workspace-friendly.
  • Dual voltage support: 110 V and 220 V compatibility for global usage.
  • Uniform heating bed without need for hot air or separate iron — simplifying the repair process.
  • Specially built for mobile phone motherboards: supports delamination, lamination, dot-matrix repair and glue removal.
  • High-quality heating bed material (aluminum alloy) for fast heat-up and thermal stability.
  • Suitable for a wide range of devices — from smartphones to complex multi-layer PCBs.
  • Durable build quality ensures long-term usage in a professional repair environment.
  • Streamlined design to fit in compact repair benches or mobile service setups.
  • Efficient glue/adhesive softening tool — reduces manual scraping and risk of damage.

 

Weight1.0 kg
Dimensions20 × 20 × 15 cm