Mechanic Welsolo VS15 Universal Stencil

Mechanic Welsolo VS15 Universal Stencil BGA Reballing for MT6322 / MT6329 / MT6261MA

The Mechanic Welsolo VS15 Universal Stencil is a high-precision BGA reballing stencil designed for professional chip-level repair and IC rework. Specifically engineered for MT6322, MT6329, and MT6261MA integrated circuits, this stencil enables accurate solder ball placement, ensuring reliable reballing and successful motherboard repairs.

Manufactured from premium stainless steel using precision laser-cut technology, the VS15 stencil offers excellent durability, heat resistance, and dimensional accuracy. The ultra-precise apertures ensure consistent solder ball alignment, helping technicians achieve clean and reliable solder joints while minimizing bridging and misalignment.

Its thin yet durable construction provides efficient heat transfer during the reballing process, making it suitable for hot air rework stations and BGA soldering applications. Whether you’re replacing power management ICs, repairing damaged chips, or restoring motherboard functionality, the Mechanic Welsolo VS15 delivers professional-grade performance.

Designed for mobile phone repair technicians, electronics engineers, and repair laboratories, this universal stencil is an essential tool for precision IC rework and long-lasting repair results.

Key Features

• Precision BGA reballing stencil for MT6322, MT6329, and MT6261MA ICs.
• High-quality stainless steel construction.
• Laser-cut apertures for accurate solder ball placement.
• Excellent heat resistance for repeated professional use.
• Thin design promotes efficient heat transfer.
• Minimizes solder bridging and alignment errors.
• Durable, reusable, and corrosion-resistant.
• Suitable for hot air and BGA rework stations.
• Ideal for smartphone motherboard and chip-level repair.
• Professional-grade quality for repair workshops and service centers.

Technical Specifications