MECHANIC XG-Z40 35G 183°C Solder Paste

MECHANIC XG-Z40 35G 183°C Solder Paste

The MECHANIC XG-Z40 35G 183°C Solder Paste is a premium-grade solution designed for precision soldering and rework applications. Engineered for professional technicians, this solder paste ensures smooth melting, excellent wettability, and strong, reliable solder joints.

With a melting point of 183°C, the XG-Z40 provides optimal performance for a wide range of PCB and mobile repair tasks. Its fine particle composition allows accurate application, making it ideal for BGA reballing, IC soldering, and micro-component repairs.

The paste delivers low residue and minimal oxidation, ensuring clean work and reducing the need for post-solder cleaning. Its stable viscosity ensures easy handling and precise control, even during intricate repair operations.

The MECHANIC XG-Z40 Solder Paste is perfect for achieving professional-quality soldering results with efficiency and consistency.

Key Features:

• 183°C low melting point for efficient soldering
• Smooth and consistent reflow performance
• Excellent wettability for strong solder joints
• Fine particle composition for precision work
• Low residue and clean soldering results
• Stable viscosity for easy application
• Ideal for BGA, IC, and PCB soldering
• Reduces oxidation and improves reliability
• Suitable for professional repair technicians
• Consistent and high-quality performance

Technical Specifications:

• Brand: MECHANIC
• Model: XG-Z40
• Product Type: Solder Paste
• Weight: 35G
• Melting Point: 183°C
• Composition: Fine solder particles + flux
• Application: PCB repair, BGA reballing, IC soldering
• Viscosity: Stable and smooth
• Residue: Low residue
• Performance: High conductivity and strong bonding
• Usage: Mobile and electronics repair
• Package Includes: 1 x MECHANIC XG-Z40 Solder Paste (35G)