Mijing AR-2020 Alpha Tin Absorbing Desoldering Wick Wire
The Mijing AR-2020 Alpha Tin Absorbing Desoldering Wick Wire is a premium-quality solution designed for efficient removal of excess solder from PCB boards, IC chips, and electronic components. Made from high-purity copper braid, it ensures rapid heat conduction and strong capillary action, allowing quick absorption of molten solder for clean and precise repair work.
Engineered with an advanced low-residue flux formula, this desoldering wick minimizes contamination and reduces the need for additional cleaning after use. Its anti-oxidation and corrosion-resistant design ensures long-lasting performance and consistent reliability during repeated operations.
The flexible woven structure allows easy access to tight spaces and delicate circuits, making it ideal for mobile phone repair, BGA rework, and motherboard maintenance. With improved absorption efficiency, it helps technicians work faster while protecting sensitive PCB tracks from damage.
Key Features
- High-purity copper braided wick for fast solder absorption
- Low residue flux formula for clean results
- Strong capillary action for efficient desoldering
- Anti-oxidation and corrosion-resistant design
- Flexible structure for tight PCB spaces
- Minimizes risk of damage to circuit boards
- Improves repair speed and efficiency
- Suitable for IC chip cleaning and BGA rework
- Easy to use for professionals and technicians
Technical Specifications
- Brand: Mijing
- Model: AR-2020
- Type: Desoldering wick / tin absorbing wire
- Material: High-purity copper braid
- Length: Approx. 2 meters (model dependent)
- Width: Approx. 2.0 mm
- Flux Type: Low residue / no-clean formula
- Properties: Anti-oxidation, corrosion-resistant
- Function: Solder removal and PCB cleaning
- Application: Mobile repair, IC rework, PCB maintenance
- Usage: Electronics repair and desoldering
