MiJing CH5-E Intelligent Mainboard Layered Welding Platform for iPhone 12 Series

Rs.6,298.00

MiJing CH5-E is a 3-in-1 intelligent motherboard layered welding platform for iPhone 12, 12 Mini, 12 Pro and 12 Pro Max, supporting A14 CPU, HHD, baseband and glue removal.

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MiJing CH5-E Intelligent Mainboard Layered Welding Platform for iPhone 12 Series

The MiJing CH5-E Intelligent Mainboard Layered Welding Platform is a professional repair fixture designed specifically for iPhone 12, 12 Mini, 12 Pro, and 12 Pro Max motherboard layered separation and welding work. Its three-in-one design supports A14 CPU chip work, A14 HHD-related repair, iPhone 12 baseband applications, and glue removal, making it a practical solution for advanced motherboard technicians.

The CH5-E combines precise positioning, controlled heating, rapid temperature rise, and digital temperature display to help technicians carry out layered motherboard repair more efficiently. The platform is designed to provide stable support during board separation and reassembly while reducing the risk of unwanted motherboard movement.

An intelligent 15-minute sleep function helps improve operational convenience, while the heating system can reach 183°C in approximately three minutes, supporting faster motherboard layer separation. The non-slip weighted design further improves stability during demanding repair operations.

Important: The newer CH5-E main unit is not compatible with the older CH5 main unit, so technicians should verify their equipment version before purchasing.

Key Features

  • 3-in-1 iPhone 12 Repair Platform: Designed for iPhone 12 series layered motherboard repair.
  • Wide iPhone 12 Compatibility: Supports iPhone 12, 12 Mini, 12 Pro, and 12 Pro Max.
  • A14 CPU Support: Suitable for A14 CPU chip repair and layered motherboard work.
  • A14 HHD Support: Designed for A14 HHD-related repair applications.
  • Baseband Repair Support: Supports iPhone 12 baseband repair and associated motherboard work.
  • Glue Removal Function: Helps technicians perform motherboard layer separation and glue removal.
  • Precise Positioning: Provides stable and accurate positioning during repair operations.
  • Rapid Heating: Reaches approximately 183°C in three minutes for efficient layer separation.
  • Digital Temperature Display: Allows technicians to monitor the heating temperature clearly.
  • Intelligent Sleep Function: Automatically enters sleep mode after approximately 15 minutes of inactivity.
  • Non-Slip Weighted Construction: Increased weight and non-slip support help keep the platform stable during repair.
  • Fast Layer Separation: Designed to make motherboard layered separation more efficient.
  • Professional Repair Fixture: Ideal for experienced mobile phone motherboard repair technicians.

Technical Specifications

Specification Details
Brand MiJing
Model CH5-E
Product Type Intelligent Mainboard Layered Welding Platform
Compatible Devices iPhone 12 / 12 Mini / 12 Pro / 12 Pro Max
CPU Support A14
Main Applications Layered Welding, Motherboard Separation, Glue Removal
Baseband Support iPhone 12 Baseband
Temperature Display Digital
Heating Performance Approx. 183°C in 3 minutes
Sleep Function Intelligent 15-Minute Sleep
Positioning Precision Positioning
Platform Design Non-Slip Weighted Design
Color Blue
Voltage 100–250V
Weight Approx. 1.65 kg
Package Includes Main Unit ×1, Extension B ×1, Extension C ×1, Power Cable ×1, Connection Cable ×1

 

MiJing CH5-E Intelligent Mainboard Layered Welding Platform MiJing CH5-E Intelligent Mainboard Layered Welding Platform

Weight 1.60 kg
Dimensions 12 × 10 × 8 cm