MIJING Z20PRO 17 MOLD

The MIJING Z20PRO 17 MOLD is an essential precision accessory for mobile phone repair technicians specializing in iPhone 17 series motherboard BGA reballing and tin planting work. This compact yet robust mold fixture provides a stable and accurate platform to hold the motherboard in place during solder paste application and reballing processes, ensuring repeatable results and minimizing the risk of errors.

Crafted for professional repair environments, the Z20PRO 17 MOLD aligns perfectly with the middle layer of iPhone 17, iPhone 17 Pro, iPhone 17 Pro Max and related variants, making it easier to apply solder balls and stencils precisely where needed. Its straightforward design enhances workflow efficiency, reduces repair time, and helps deliver consistent, high-quality reballing outcomes during hot-air gun or rework station processes.

Whether you’re troubleshooting BGA connections, replacing chips, or performing advanced motherboard repairs, the MIJING Z20PRO 17 MOLD is a reliable and cost-effective tool for professional service centers and DIY repair technicians alike.

⭐ Key Features

• 📏 Precision Mold Platform for accurate BGA tin planting alignment
• 📱 Designed for iPhone 17 Series Middle Layer including Pro and Pro Max
• ⚙️ Stable PCB Holding during reballing & stencil placement
• 🔩 Perfect Fit for Stencil Work to ensure even solder ball application
• 🔥 Supports Hot-Air Rework Processes for solder solidification
• 🛠️ Lightweight & Compact Design for easy workstation use
• 🧰 Improves Repair Accuracy and reduces rework errors
• 💪 Durable Construction for repeated workshop applications
• 👨‍🔧 Ideal for Mobile Repair Technicians and advanced DIY use
• 🧪 Efficient BGA Reballing Accessory to speed up repair workflow

📊 Technical Specifications