MiJing Z23 Samsung S20-S26 Ultra Mid-Layer BGA Reballing Platform

MiJing Z23 Samsung S20-S26 Ultra Mid-Layer BGA Reballing Platform

The MiJing Z23 Samsung S20-S26 Ultra Mid-Layer BGA Reballing Platform is a specialized motherboard repair fixture designed for Samsung Galaxy S20 through S26 Ultra series mid-layer motherboard repair and BGA reballing. It provides stable positioning and precise alignment to help technicians perform demanding board-level repair procedures more efficiently.

The platform is designed to support mid-layer motherboard positioning, making it useful for BGA reballing, IC repair, CPU-related board work, and other component-level operations. Its dedicated structure helps keep the motherboard securely positioned during soldering and reballing processes.

For professional mobile repair technicians, the MiJing Z23 provides a practical solution for handling layered Samsung motherboards while improving stability and consistency during precision repair work.

Key Features

• Samsung S20–S26 Ultra Compatibility – Designed for mid-layer motherboard repair across supported Samsung Ultra series models.
• Mid-Layer BGA Reballing Platform – Specifically developed for layered motherboard rework and reballing applications.
• Stable Board Positioning – Helps keep the motherboard securely aligned during precision operations.
• BGA Reballing Support – Suitable for solder-ball placement and BGA component rework.
• Precision Alignment – Helps improve positioning accuracy during motherboard repair.
• IC & CPU Repair Support – Useful for component-level work involving BGA-mounted components.
• Professional Motherboard Fixture – Designed for experienced mobile phone repair technicians.
• Reduced Board Movement – Provides a more stable working surface during delicate soldering tasks.
• Wide Samsung Application – Suitable for supported Galaxy S20–S26 Ultra mid-layer repair workflows.
• Reusable Repair Platform – Designed for repeated motherboard repair and reballing operations.

Technical Specifications