AMAOE Stencil-QU8

AMAOE QU8 Stencil for Qualcomm CPU

The AMAOE QU8 Stencil for Qualcomm CPU is a precision BGA reballing tool crafted for professional mobile repair technicians and electronics engineers. Made from high-quality stainless steel with a 0.12 mm thickness, this stencil provides accurate alignment for solder paste or solder balls on Qualcomm Snapdragon CPU and RAM pads, ensuring reliable connections and consistent rework performance.

Ideal for use in logic board repairs, chip replacements, and motherboard rework tasks, the QU8 stencil supports a range of popular Qualcomm chipsets — including SM8250 variants, SM8350, and SDM439 configurations found in many mid-range and flagship devices. Its laser-cut aperture design guarantees uniform paste application, reduces solder bridging, and improves overall repair precision.

Whether you’re performing complex chipset reballing or detailed CPU/RAM soldering, the Amaoe QU8 stencil enhances accuracy and reliability in every repair job, making it an essential addition to your professional toolkit.

Key Features:

• Precision BGA stencil for Qualcomm CPU & RAM reballing
• Designed for Snapdragon processors including SM8250, SM8350 & SDM439
• High-quality 0.12 mm stainless steel material
• Laser-cut aperture design for uniform solder paste application
• Minimizes solder bridging and improves joint integrity
• Durable, heat-resistant build for workshop use
• Reusable and easy to clean after use
• Compatible with hot-air rework and soldering tools
• Saves repair time and enhances accuracy
• Ideal for professional mobile repair technicians

Technical Specifications:

• Brand: AMAOE
• Model: QU8
• Material: Premium stainless steel
• Thickness: 0.12 mm
• Application: Qualcomm CPU and RAM BGA reballing
• Supported Chipsets: SM8250 102 CPU, SM8250 002 CPU, SM8250 102 RAM, SM8250 002 RAM, SM8350 RAM, SDM439
• Surface Finish: Corrosion-resistant metallic finish
• Reusable: Yes
• Weight: Approx. 0.1 kg
• Use Case: Mobile motherboard repair and reballing