Quick 2008 Rework Station SMD

Rs.7,998.00

1 sold

Quick 2008 SMD Rework Station is a powerful hot-air tool designed for mobile, laptop & PCB repair. It offers fast heating, precise temperature control and stable airflow — perfect for SMD, BGA and micro-soldering work.

Quick 2008 Rework Station SMD

The Quick 2008 SMD Rework Station is a professional-grade hot-air rework system built for technicians who demand precision, efficiency and reliability in their repair workflow. Whether you’re removing SMD ICs, reworking BGA chips or performing motherboard-level microsoldering, this station delivers consistent airflow and stable temperature control to ensure clean, damage-free rework results.

Powered with intelligent heat control, Quick-2008 heats rapidly and maintains accuracy even during continuous operation. Its ergonomic hot-air handle and adjustable airflow make it suitable for sensitive chip removal, heat shrink tubing, lead-free solder jobs and component reballing. With durable build quality, long-life heating element and multiple nozzle compatibility, Quick 2008 stands out as a reliable choice for professional repair labs and technical workstations.

Designed for speed, precision and long-term performance — a must-have tool for every electronics repair expert.


Key Features

  • 🔥 Fast Heat-Up Technology for quick workflows and efficient chip removal
  • 🎚 Adjustable Temperature Control ideal for SMD/BGA & micro-rework
  • 🌪 Stable Airflow Output prevents overheating and component damage
  • 🛠 Supports Multiple Hot-Air Nozzles for wide repair compatibility
  • ⚡ Ideal for Mobile & Laptop Motherboard Repair
  • 🔄 Closed-Loop Temperature Control for consistent heat delivery
  • 🧊 Cooling Function to Protect Heating Core & Handle
  • 🏗 Durable Industrial-Grade Build for continuous use
  • 💡 User-Friendly Operation with intuitive control panel
  • 🔌 Reliable High-Power Performance for long repair sessions

Technical Specifications

Specification Details
Model Quick 2008 SMD Rework Station
Power Output High-performance hot-air system
Temperature Range Typically adjustable for SMD/BGA rework
Airflow Control Variable airflow for precision tasks
Nozzle Compatibility Supports multiple sizes for diverse component repair
Display Type Digital control panel (varies by unit batch)
Application SMD/BGA IC removal, PCB rework, heat-shrink & soldering
Weight 2.5 kg
Dimensions 30 × 19 × 18 cm