Quick 857DW+ Lead Free Adjustable SMD Rework Station 100% Original

Rs.6,000.00

2 sold

Quick 857DW Lead-Free Adjustable SMD Rework Station is designed for high-precision motherboard repair with fast heating, adjustable airflow and lead-free solder compatibility.


QUICK 857DW+ LEAD FREE ADJUSTABLE SMD REWORK STATION

The Quick 857DW Lead-Free Adjustable SMD Rework Station is a professional hot-air rework tool engineered for mobile, computer and PCB technicians who demand accuracy and reliability in every repair. Built with intelligent temperature stabilization, this machine ensures even heating for delicate SMD and BGA components without causing board damage.

Its lead-free supported design makes it ideal for modern electronic boards that require controlled heat flow and strong thermal consistency. With smooth airflow adjustment, anti-static structure, and user-friendly controls, Quick 857DW helps technicians remove ICs, reflow joints, repair motherboards and troubleshoot hardware faults with confidence.

Whether you run a repair shop or work as a micro-soldering expert, this rework station delivers stable performance for long working hours — powerful, precise and built for professional-grade results.


Key Features

  • 🔥 Lead-Free Compatible for modern PCB & motherboard standards
  • Fast Heating Technology for quick chip removal and rework
  • 🌡 Adjustable Temperature Control for delicate SMD/BGA components
  • 🌪 Variable Airflow Output prevents overheating and pad lifting
  • 🛠 Ideal for Mobile, Laptop & PCB Rework
  • 🎯 Stable Thermal Control System ensures consistent heating
  • 🏗 Durable Build for Heavy-Duty Lab Use
  • 👨‍🔧 User-Friendly Control Knobs & Digital Indicators
  • 🔄 Suitable for Long Continuous Operation
  • 🔌 Supports Multiple Hot-Air Nozzles for versatile repair tasks

    Technical Specifications

    SpecificationDetails
    ModelQuick 857DW Lead-Free SMD Rework Station
    Heating TypeHot Air Rework System
    Temperature RangeAdjustable for SMD/BGA rework
    Airflow ControlStepless / Variable airflow
    CompatibilitySupports lead-free soldering
    Suitable ForMobile PCB, Laptop board, IC rework, BGA repair
    PowerHigh-efficiency heating output (model-based)
    Nozzle SupportMultiple nozzle sizes for different components

 

Weight3.0 kg
Dimensions30 × 14 × 18 cm