RELIFE RL-044 IPZ13 Stencil

The RELIFE RL-044 IPZ13 Stencil is a professional precision reballing stencil specially designed for iPhone 14, iPhone 14 Plus, iPhone 14 Pro, and iPhone 14 Pro Max motherboard repair applications. Compatible with A15 and A16 CPU ICs, this high-precision stencil provides accurate alignment and efficient tin planting support for advanced chip-level repair and reballing procedures.

Engineered for professional smartphone repair technicians and microsoldering specialists, the RL-044 IPZ13 stencil ensures precise solder ball placement during CPU rework, IC maintenance, and PCB repair operations. Its ultra-precise hole positioning improves soldering accuracy, reduces repair errors, and enhances efficiency in delicate motherboard maintenance tasks.

Manufactured from high-quality durable steel material, the stencil offers excellent heat resistance, long-lasting performance, and reliable stability for repeated professional use in repair laboratories and electronics workshops.

Key Features:

• 🔧 Professional CPU reballing stencil for iPhone 14 series
• 📱 Compatible with iPhone 14 / 14 Plus / 14 Pro / 14 Pro Max
• ⚡ Supports A15 and A16 CPU IC repair applications
• 🎯 High-precision hole alignment for accurate tin planting
• 🛠️ Ideal for motherboard repair and chip-level maintenance
• 💪 Durable heat-resistant steel construction
• 🔄 Improves soldering accuracy and repair efficiency
• 🔍 Suitable for microsoldering and IC rework procedures
• 🚀 Essential tool for advanced smartphone repair technicians
• 🧲 Designed for professional repair labs and workshops

Technical Specifications:

• Brand: RELIFE
• Model: RL-044 IPZ13
• Product Type: CPU Reballing Stencil
• Compatibility: iPhone 14 Series
• Supported Chips: A15 / A16 CPU IC
• Application: Motherboard repair and IC reballing
• Function: Tin planting and solder ball alignment
• Material: High-precision stainless steel
• Feature: Heat-resistant durable stencil design
• Usage: Microsoldering and PCB repair operations