Relife RL-402 Soldering Paste
Rs.290.00
Premium Relife RL-402 Soldering Paste with 183°C melting point, designed for smooth BGA reballing, strong joints, and clean, residue-free mobile repair work.
Relife RL-402 Soldering Paste (183°C No-Clean, Sn63/Pb67)
The Relife RL-402 Soldering Paste is a high-performance no-clean solder paste specially designed for mobile phone repair, BGA reballing, and SMT soldering applications. With a low melting point of 183°C, it ensures smooth solder flow, quick bonding, and minimal thermal stress on sensitive components.
Formulated with fine alloy particles (20–38µm), this paste delivers excellent wettability and strong adhesion, allowing precise application and uniform solder joints. Its no-clean formula leaves minimal residue, reducing post-repair cleaning time and improving overall efficiency.
Ideal for professional technicians and repair shops, the RL-402 provides consistent performance, reliable conductivity, and clean finishing, making it an essential consumable for high-precision electronics repair.
Key Features:
- No-clean formula for minimal residue after soldering
- Low melting point (183°C) for safe and efficient work
- Fine particle size (20–38µm) for precision application
- Excellent wettability and strong adhesion
- Smooth solder flow for clean and uniform joints
- Ideal for BGA reballing and SMT soldering
- Reduces thermal damage to sensitive components
- Suitable for mobile phone and PCB repair
- Easy to apply with syringe or applicator
- Professional-grade performance for technicians
Technical Specifications:
- Brand: Relife
- Model: RL-402
- Type: No-clean soldering paste
- Alloy Composition: Sn63 / Pb67
- Melting Point: 183°C
- Particle Size: 20–38µm
- Net Weight: Approx. 40g
- Application: BGA, SMT, PCB soldering
- Compatibility: Mobile phones, IC chips, circuit boards
- Residue: Low / No-clean
- Package Includes: 1 x Relife RL-402 Soldering Paste
| Weight | 0.150 kg |
|---|---|
| Dimensions | 15 × 12 × 10 cm |
