Description

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RELIFE RL-404 Lead-free Solder Paste Low Temperature Melting Point 138 Degrees Tin Paste Phone PCB BGA/SMD Template Repair Tin

Item Specification :

• Meet the maintenance needs of motherboards for Samsung, Oppo, Vivo,Redmi and Apple etc. high-end machines
• A low temperature lead-free solder paste customized for high-end motherboard repair
• RL-404 138 ° C low temperature solder paste

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