RF4 RF-H9 Temperature Control BGA Hot Air Rework Desoldering Station with Hang-up Function

Rs.5,398.00

RF4 RF-H9 BGA hot air rework station with temperature control and hang-up function, designed for precise IC, SMD, PCB, and mobile phone repair.

Out of stock

RF4 RF-H9 Temperature Control BGA Hot Air Rework Desoldering Station with Hang-up Function

The RF4 RF-H9 Temperature Control BGA Hot Air Rework Desoldering Station with Hang-up Function is a professional heating and desoldering solution designed for mobile phone repair, PCB rework, BGA component servicing, IC replacement, and precision electronics maintenance. Combining accurate temperature control with powerful hot air performance, the RF-H9 helps technicians perform controlled heating, solder melting, component removal, and rework with greater efficiency.

The station features a temperature-controlled hot air system that allows users to adjust the heating level according to different components and repair requirements. Stable airflow and controlled heat distribution help minimize unnecessary thermal stress during delicate PCB and motherboard work.

Its hang-up function provides convenient storage for the hot air handle when not in use, keeping the workstation organized while reducing the risk of accidental contact with the hot nozzle. The practical design is particularly useful for busy professional repair benches where accessibility and safety are important.

The RF-H9 is suitable for BGA rework, IC desoldering, SMD component replacement, connector removal, soldering preparation, adhesive softening, and PCB repair. Its compact professional design makes it suitable for mobile phone service centers, electronics repair shops, laboratories, and DIY technicians.

Whether working on smartphones, tablets, laptops, motherboards, gaming devices, or other electronic assemblies, the RF4 RF-H9 BGA Hot Air Rework Station provides reliable temperature-controlled heating for precision repair applications.

Key Features

  • Professional hot air rework and desoldering station.
  • Adjustable temperature control for precision heating.
  • Designed for BGA, SMD, IC, and PCB rework.
  • Stable hot air performance for controlled solder melting.
  • Hang-up function for convenient hot air handle storage.
  • Suitable for component removal and replacement.
  • Helps soften adhesives during electronics repair.
  • Practical design for professional repair workstations.
  • Suitable for mobile phone and motherboard repair.
  • Ideal for electronics technicians, service centers, and laboratories.

Technical Specifications

Specification Details
Product Name RF4 RF-H9 Temperature Control BGA Hot Air Rework Station
Model RF-H9
Product Type Hot Air Rework & Desoldering Station
Heating System Temperature-Controlled Hot Air
Function Heating, Desoldering, BGA & SMD Rework
Handle Storage Hang-up Function
Applications PCB Repair, IC Rework, BGA Desoldering, SMD Component Replacement
Suitable For Mobile Phones, Tablets, Laptops & Electronic Boards
Usage Professional Electronics Repair & Maintenance

 

RF4 RF-H9 BGA Hot Air Rework Station

Weight 4.0 kg
Dimensions 25 × 20 × 18 cm