RELIFE RL-421S-OR BGA Solder Flux Paste (10CC) for PCB & Mobile Repair
The RELIFE RL-421S-OR Solder Flux Paste (10CC) is a high-performance solution designed for precision soldering, BGA rework, and PCB repair applications. Engineered with a high-viscosity, no-clean formula, this flux ensures accurate application and excellent soldering results for professional technicians.
This premium flux paste enhances solder wetting, flow, and bonding strength, making it ideal for working on SMD components, IC chips, and complex circuit boards. Its advanced formulation effectively removes oxidation, ensuring strong, reliable, and clean solder joints.
The RL-421S-OR produces minimal non-corrosive residue, reducing the need for post-solder cleaning while protecting sensitive electronic components. It also features fast tinning with low smoke emission, creating a safer and more efficient working environment.
Packed in a convenient 10CC syringe with needle applicator, it allows precise and controlled dispensing, making it perfect for mobile repair labs, electronics workshops, and DIY users.
Key Features
- High-viscosity solder flux paste for precise application
- Ideal for BGA, SMD, and PCB soldering
- Improves solder wetting and bonding strength
- Effectively removes oxidation from pads and components
- No-clean, low-residue formula
- Fast tinning with minimal smoke
- High insulation resistance for safe repairs
- Syringe design for accurate dispensing
- Suitable for mobile phone and motherboard repair
- Professional-grade performance
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | RELIFE RL-421S-OR Flux Paste |
| Brand | RELIFE |
| Model | RL-421S-OR |
| Type | Solder Flux Paste |
| Capacity | 10CC |
| Formula | No-Clean, High Viscosity |
| Residue | Low / Non-Corrosive |
| Application | BGA, SMD, PCB Repair |
| Packaging | Syringe with Needle |
| Usage | Professional & DIY |














