Sunshine SS-T12C IC Glue Remover

Sunshine SS-T12C IC Glue Remover

The Sunshine SS-T12C IC Glue Remover is a professional motherboard repair heating module specifically designed for the safe removal of adhesive around IC chips, CPUs, NAND chips, and BGA components. It provides controlled and uniform heating that softens hardened glue and underfill material, making chip removal easier while reducing the risk of motherboard damage.

Designed for advanced mobile phone repair and chip-level maintenance, the SS-T12C helps technicians efficiently remove stubborn adhesive before performing IC replacement, CPU reballing, or motherboard restoration. The precision heating system ensures even temperature distribution, preventing excessive localized heat and protecting nearby components.

Manufactured from high-quality materials, the Sunshine SS-T12C delivers stable performance and long-term durability in professional repair environments. Its compact design makes it ideal for use with mobile phone motherboards, tablets, and other electronic circuit boards requiring adhesive removal before repair operations.

Whether you’re performing CPU repairs, BGA rework, IC replacement, or motherboard refurbishment, the Sunshine SS-T12C IC Glue Remover improves repair efficiency and increases the success rate of chip-level repairs.

A must-have tool for professional technicians, repair centers, and electronics service workshops.

Key Features:

• 🔥 Professional IC glue removal heating module
• 🎯 Softens underfill adhesive for easier chip removal
• 🛠️ Ideal for CPU, NAND, IC, and BGA repairs
• ⚡ Uniform heat distribution for safe operation
• 📱 Suitable for smartphone and tablet motherboards
• 🔍 Reduces risk of PCB and component damage
• ♨️ Improves chip removal efficiency and accuracy
• 💪 Durable construction for long-term professional use
• 🚀 Enhances chip-level repair success rates
• 🏆 Essential tool for motherboard repair technicians

Technical Specifications:

• Brand: Sunshine
• Model: SS-T12C
• Product Type: IC Glue Remover Heating Module
• Function: IC Adhesive Softening and Glue Removal
• Application: CPU Repair, IC Replacement, BGA Rework
• Heating Method: Uniform Thermal Heating
• Compatible Devices: Mobile Phones, Tablets, Electronic Motherboards
• Features: Stable Heating, Precise Temperature Distribution
• Construction: Professional-Grade Durable Materials
• Suitable For: Mobile Repair Technicians and Service Centers