TBK 2208Pro Intelligent Imager for Semiconductor Packaged Devices & Integrated Electronic Components
The TBK 2208Pro Intelligent Imager is a professional desktop non-destructive X-ray inspection and semiconductor analysis system engineered for advanced BGA, IC, PCB, and semiconductor packaged device diagnostics. Designed for repair labs, quality control centers, and electronics manufacturing, this high-precision intelligent imager provides detailed internal visualization of integrated circuits, solder joints, chip packaging, wire bonds, and multilayer PCB structures without physical disassembly or damage. TBK positions the 2208Pro as an intelligent imaging solution for semiconductor packaged devices and integrated electronic components.
Powered by advanced X-ray imaging technology, the TBK 2208Pro helps technicians detect BGA voids, cold solder joints, bridging, internal chip damage, counterfeit components, and hidden motherboard faults with exceptional clarity. Its compact desktop form factor combines industrial-level diagnostic capability with workshop-friendly operation, making it ideal for mobile phone motherboard repair, semiconductor verification, PCB quality assurance, and precision failure analysis.
Built with high-density lead shielding protection, intelligent software controls, and one-click image capture, the 2208Pro offers safe, efficient, and reliable operation while maintaining high-resolution imaging for critical inspection tasks. This machine is an essential solution for professionals requiring accurate internal diagnostics, semiconductor verification, and chip-level quality analysis. TBK’s desktop X-ray platform emphasizes non-destructive inspection, lead shielding, and BGA/IC internal imaging for repair and QA workflows.
Key Features
- Advanced non-destructive X-ray imaging system
- Designed for semiconductor packaged device testing
- Ideal for BGA, IC, CPU, and PCB internal inspection
- Detects solder voids, bridging, cold joints, and hidden defects
- High-resolution imaging for chip-level diagnostics
- Intelligent one-click image capture system
- Compact desktop industrial design
- High-density lead shielding for operator safety
- Suitable for mobile repair, QC labs, and electronics manufacturing
- Professional-grade semiconductor analysis solution
Technical Specifications
- Brand: TBK
- Model: 2208Pro
- Type: Intelligent semiconductor / X-ray inspection imager
- Inspection Method: Non-destructive X-ray imaging
- X-ray Tube Voltage: 60kV
- X-ray Tube Current: 0.8mA
- Pixel Diameter: 35μm
- Detector Area: 25 × 35mm
- Resolution: 688 × 834px
- Power Supply: 110V / 220V compatible
- Safety: Integrated heavy lead shielding chamber
- Application: Semiconductor inspection, BGA repair, PCB QA, motherboard diagnostics
