Wylie WL-207F Yitian Needle Ultra-Fine High-Toughness Chip Pry Tool – Professional Motherboard CPU IC Disassembly Tool
The Wylie WL-207F Yitian Needle Ultra-Fine High-Toughness Chip Pry Tool is a professional-grade precision disassembly instrument engineered for advanced mobile phone technicians, motherboard repair specialists, and chip-level electronics professionals. Martview lists the WL-207F as a dedicated ultra-fine, high-toughness pry tool specifically designed for motherboard CPU, IC, and chip disassembly, making it ideal for delicate chip lifting, underfill glue removal, and micro-component servicing.
Built for high-precision repair environments, the WL-207F features an ultra-fine needle-style pry tip that provides exceptional access to narrow chip edges and tightly bonded IC surfaces. Its high-toughness metal construction is designed to resist bending or deformation during demanding CPU and IC lifting procedures, while maintaining precise control for safer motherboard work. This makes it especially valuable for underfill black glue removal, CPU edge lifting, NAND servicing, and micro-solder preparation.
Key Features
- Ultra-Fine Needle Tip Design: Precision access for CPU, IC, and microchip disassembly
- High-Toughness Steel Construction: Strong, durable, and resistant to bending under pressure
- Specialized for Motherboard Chip Repair: Ideal for CPU, NAND, IC, and underfill glue tasks
- Precision Glue Removal: Helps remove black glue and side adhesive around chips
- Professional Chip Pry Performance: Suitable for delicate edge lifting without excessive board damage
- Slim Repair-Grade Profile: Designed for narrow spaces and high-detail motherboard work
- Non-Bulky Ergonomic Handling: Improved control during precision chip servicing
- Essential GSM Repair Tool: Built for advanced smartphone motherboard repair benches
Technical Specifications
- Brand: Wylie
- Model: WL-207F Yitian Needle
- Product Type: Ultra-Fine Chip Pry Tool / Motherboard Disassembly Needle
- Tip Style: Needle-point ultra-fine precision pry tip
- Material: High-toughness alloy steel
- Primary Applications: CPU disassembly, IC lifting, NAND servicing, black glue removal
- Repair Scope: Mobile motherboard repair, chip-level maintenance, PCB micro repair
- Design Purpose: Precision chip edge access and controlled lifting
- Compatibility: Smartphones, tablets, motherboard ICs, CPU/NAND chips
- Usage Environment: Professional GSM repair labs, microsoldering stations, PCB repair benches
