YCS 183 Solder Paste PPD 50G

Enhance your soldering performance with the YCS 183 Solder Paste PPD 50G, a high-quality solution designed for BGA reballing, SMT soldering, and PCB repair applications. With a low melting point of 183°C, this paste ensures efficient heat transfer, reducing the risk of thermal damage to sensitive electronic components.

Formulated for smooth flow and excellent wettability, the YCS 183 solder paste delivers uniform solder joints with strong electrical conductivity. Its optimized consistency makes application easy, while the low-residue formula ensures a cleaner finish with minimal post-solder cleaning.

Ideal for professional mobile repair technicians and electronics enthusiasts, this solder paste provides reliable performance, precision, and durability in every repair job.

Key Features:

• Low melting point (183°C) for safe soldering
• Smooth flow for precise and uniform application
• Strong adhesion and reliable conductivity
• Ideal for BGA reballing and SMT soldering
• Low residue formula for clean results
• Reduces solder bridging and defects
• Suitable for mobile phone and PCB repair
• Easy to apply and work with
• Consistent performance for professional use
• Enhances repair quality and efficiency

Technical Specifications:

• Brand: YCS
• Product Name: 183 Solder Paste PPD
• Net Weight: 50 Gram
• Melting Point: 183°C
• Application: BGA reballing, SMT soldering, PCB repair
• Composition: Fine alloy solder particles
• Residue: Low residue / semi no-clean
• Compatibility: Mobile phones, IC chips, circuit boards
• Packaging: Jar/Container
• Reusability: Multiple applications
• Package Includes: 1 x YCS 183 Solder Paste PPD 50G