Out of Stock

YCS A19 Pro NFC Soldering Stencil Kit

Name: YCS A19 Pro NFC Soldering Stencil Kit
Brand: YCS
SKU: YCSA19PRO
Availability: OutOfStock

Brand: YCS Categories: Mobile Repair Tools, New Arriavals, YCS Tools SKU: YCSA19PRO Tags: BGA rework stencil, chip reballing stencil, front camera repair stencil, iPhone 17 Air repair tool, iPhone 17 Pro Max stencil, Mobile Repair Tools, NFC stencil kit, PCB repair tools, technician soldering kit, YCS A19 Pro

Rs.298.00

Rated 0 out of 5

YCS A19 Pro NFC Soldering Stencil Kit is a professional BGA rework template set designed for iPhone 17 Pro Max and 17 Air NFC chip repair.

Out of stock

Description
Specification

YCS A19 Pro iPhone 17 Pro Max & 17 Air NFC soldering stencil kit for front camera NFC chip repair

The YCS A19 Pro iPhone 17 Pro Max / 17 Air NFC Soldering Stencil Kit is a high-precision repair solution specially designed for front camera NFC chip repair and BGA rework applications. Engineered for professional technicians, this stencil kit ensures accurate solder alignment and reliable chip-level repair performance.

Manufactured from premium heat-resistant stainless steel, the stencil templates deliver exceptional durability and precision during repeated soldering operations. The ultra-fine laser-cut hole design allows accurate solder ball placement, improving repair efficiency and reducing rework errors.

Designed specifically for iPhone 17 Pro Max and iPhone 17 Air NFC modules, the YCS A19 Pro kit is ideal for repairing front camera circuits, NFC chips, and delicate motherboard components. Its precise alignment system helps technicians achieve professional-grade soldering results with improved consistency.

Compact, lightweight, and easy to use, this professional BGA rework template set is an essential tool for advanced mobile repair labs and chip-level technicians.