2UUL BH17 CPU REBALL BASE Magnetic Dual-Sided Reballing Platform Set (iPhone & Android)

2UUL BH17 CPU REBALL BASE Magnetic Dual-Sided Reballing Platform Set

Take your BGA reballing workflow to the next level with the 2UUL BH17 CPU Reball Base Magnetic Dual-Sided Platform Set — a precision-engineered fixture designed for mobile repair professionals and microsoldering labs. This platform offers two magnetic working surfaces, enabling fast switching between different types of CPUs or IC chips without losing alignment. Built from durable, heat-resistant alloy, the BH17 base ensures consistent, stable positioning even during high-temperature reflow.

Strong magnetic clamps hold chips firmly in place, reducing the risk of displacement when heating and improving the reliability of solder ball placement. Whether you’re reballing iPhone A-series CPUs, Android Exynos/Qualcomm chips, or NAND/EMMC ICs, the BH17 base supports accurate alignment and repeatable results. Compact yet robust, it’s an ideal partner for your stencil setups and BGA repair stations.

⚙️ Key Features

• Dual-sided magnetic platform allows you to reball two different chips sequentially.
• Strong magnetic hold ensures chips remain securely fixed during heating and reflow.
• High precision alignment helps you drop solder balls reliably and evenly.
• Heat-resistant metal body designed to withstand the high temperatures of hot-air rework.
• Compact and portable design — easy to place on your reballing workstation.
• Built for mobile CPUs and ICs — compatible with a wide range of chipsets (iPhone, Android, etc.).
• Durable and stable — CNC-machined to maintain its form and magnetic strength over time.
• Improves reballing accuracy — reduces misalignment and ball bridging during soldering.
• Professional-grade tool — built for reuse in repair shops, labs, and high-volume BGA rework environments.
• Saves time — dual surfaces let you keep one side ready while working on another, increasing throughput.