AMAOE Stencil Power IC PM3

The AMAOE PM3 Power IC Stencil is an essential precision tool for mobile repair technicians and electronics professionals working on Qualcomm Power Management ICs. This stencil ensures highly accurate solder ball alignment for power IC reballing and SMD repair tasks, helping improve repair consistency and quality.

Constructed from premium stainless steel with precision laser-cut holes, the PM3 stencil maintains its shape even under high heat during rework and soldering processes. Its compact design makes it ideal for focused reballing work on power IC components found on modern smartphone motherboards.

Whether you’re restoring power circuits, replacing damaged power chips, or performing advanced BGA rework, the AMAOE PM3 Stencil delivers reliable and consistent results for professional repair environments.

Key Features:

• Precision laser-cut stainless steel BGA stencil
• Designed specifically for Qualcomm Power Management ICs
• Accurate solder ball alignment for reliable reballing
• Heat resistant for repeated workshop use
• Durable, reusable and long-lasting design
• Compact and lightweight for ease of use
• Smooth surface for easy cleaning
• Ideal for mobile phone motherboard IC repair

Technical Specifications:

• Brand: AMAOE
• Model: PM3
• Compatibility: Qualcomm Power Management ICs
• Material: Premium stainless steel
• Type: BGA Reballing Stencil
• Manufacturing: Precision laser-cut technology
• Application: Power IC solder ball placement and reballing
• Usage: Mobile motherboard and power IC repair