AMAOE Stencil universal

The Universal Reballing Stencil is a versatile and high-precision solder reballing tool crafted for technicians who handle BGA and IC rework across a range of smartphones, tablets, and PCBs. Manufactured from high-quality stainless steel with laser-cut micron-accurate apertures, this stencil delivers consistent solder ball placement with minimal bridging and maximum repeatability.

Its universal pattern supports a wide variety of pitch sizes, making it ideal for reballing tasks on logic boards, chipsets, and memory modules. Whether you’re restoring pads, performing BGA rework, or building jumpers, this stencil enhances accuracy and reduces rework time, making it an essential accessory for professional repair labs and electronics service centers.

⭐ Key Features

• Precision laser-cut stainless steel for long life
• Universal aperture pattern fits multiple BGA/IC sizes
• Ensures accurate solder ball alignment
• Reduces solder bridging and rework errors
• High heat resistance for reflow applications
• Smooth edges for reliable solder release
• Durable and reusable for high-volume use
• Ideal for phone, tablet, laptop and motherboard repair
• Improves repair success rate and workflow
• Essential tool for professional technicians

⚙️ Technical Specifications