Aixun AX-FT06 PRO 6-in-1 Middle Layer Tin Planting Platform for iPhone X to 11 Pro Max
The Aixun AX-FT06 PRO 6-in-1 Middle Layer Tin Planting Platform is a professional reballing and tin planting fixture designed for iPhone motherboard repair from iPhone X through iPhone 11 Pro Max. It provides precise positioning and stable support when applying solder paste and forming uniform solder balls on motherboard layers.
The platform features a two-sided design with strong magnetic adsorption, helping the stencil align securely with the motherboard during the tin planting process. Its structured positioning system is designed to make reballing operations more accurate and convenient for professional technicians.
The AX-FT06 PRO supports multiple iPhone motherboard models and comes with dedicated steel stencils for compatible boards. The included slot cover helps protect surrounding areas and can help reduce solder paste leakage during the tin planting process.
Key Features
- 6-in-1 Reballing Platform: Designed for multiple compatible iPhone motherboard repair applications.
- Wide iPhone Compatibility: Supports iPhone X, XS, XS Max, 11, 11 Pro, and 11 Pro Max.
- Strong Magnetic Adsorption: Helps keep the stencil accurately positioned during reballing.
- Two-Sided Design: Provides front and rear positioning for supported motherboard layouts.
- Precision Positioning: Helps align the motherboard and stencil for consistent tin planting.
- Fast Reballing Workflow: Designed to simplify solder paste application and motherboard reballing.
- Metal Alloy Positioning Frame: Provides a stable structure for precision repair operations.
- Nano-Coated Stencils: The included black reballing stencils use a nano-coating/plating process.
- Slot Cover: Helps prevent solder paste leakage and unwanted contact around the repair area.
- Professional Repair Tool: Suitable for mobile phone motherboard repair shops and microsoldering technicians.
Technical Specifications
| Specification | Details |
|---|---|
| Brand | Aixun |
| Model | AX-FT06 PRO |
| Product Type | 6-in-1 Middle Layer Tin Planting / Reballing Platform |
| Primary Application | iPhone Motherboard Reballing |
| Supported Models | iPhone X, XS, XS Max, 11, 11 Pro, 11 Pro Max |
| Design | Two-Sided |
| Positioning | Precision Magnetic Positioning |
| Magnetic System | Strong Magnetic Adsorption |
| Stencil Thickness | 0.1 mm |
| Number of Stencils | 5 |
| Stencil Type | Steel Reballing Stencils |
| Main Function | Tin Planting, Solder Paste Application & Reballing |
| Frame Material | Metal Alloy |
| Color | Blue |
| Package | Tin Planting Platform, 5 Steel Meshes, 2 Shield Covers* |

























