Amaoe 20-in-1 Stencil Set – Complete BGA Reballing Solution

The Amaoe 20-in-1 Stencil Set is a comprehensive BGA reballing kit designed for professional mobile repair technicians. This all-in-one set includes 20 high-precision stencils, making it ideal for CPU, PMIC, eMMC, and chipset reballing across multiple smartphone brands.

Crafted from premium-grade stainless steel with ultra-precise laser-cut holes, each stencil ensures uniform solder ball placement and minimizes bridging or misalignment. The heat-resistant and reusable design makes this set perfect for high-temperature rework processes and long-term workshop use.

Whether you operate a busy service center or perform advanced chip-level repairs, the Amaoe 20-in-1 Stencil Set delivers accuracy, efficiency, and reliability in every reballing task.

Key Features:

• Complete 20-piece BGA stencil kit
• Suitable for multiple smartphone brands and chipsets
• High-precision laser-cut apertures
• Uniform and accurate solder ball formation
• Premium stainless steel construction
• Heat-resistant and reusable design
• Reduces solder bridging and alignment errors
• Ideal for CPU, PMIC, eMMC, and chipset reballing
• Designed for professional mobile repair technicians

Technical Specifications:

• Brand: Amaoe
• Product Type: 20-in-1 BGA Stencil Set
• Material: High-grade stainless steel
• Number of Stencils: 20 pieces
• Application: CPU / PMIC / eMMC / chipset reballing
• Manufacturing Process: Precision laser cutting
• Heat Resistance: High temperature resistant
• Usage Level: Professional and advanced technicians