Amaoe A15 CPU 0.12mm Stencil

Amaoe A15 CPU 0.12mm Reballing Stencil for iPhone Chip Repair

The Amaoe A15 CPU 0.12mm Stencil is a high-precision BGA reballing stencil designed for Apple A15 processor chip repair and reballing. This professional tool enables technicians to accurately rebuild solder balls on the A15 CPU used in modern iPhone motherboards, ensuring reliable chip connections during advanced smartphone repair procedures.

Crafted from premium stainless steel using advanced laser-cut technology, the stencil provides perfectly aligned holes for accurate solder ball placement. The 0.12mm ultra-thin design ensures excellent heat transfer during soldering, allowing technicians to achieve stable and clean reballing results while reducing the risk of solder bridging.

The Amaoe A15 CPU stencil is specifically engineered for chip-level repair and CPU reballing, making it an essential tool for technicians performing micro-soldering and motherboard repair on A15-powered iPhones. Its durable and reusable construction ensures long-lasting performance for professional repair environments.

Ideal for GSM repair technicians, mobile repair centers, and electronics service labs, the Amaoe A15 CPU stencil provides precise alignment and reliable results for complex smartphone motherboard repairs.

Key Features

• Designed for Apple A15 CPU chip reballing and repair
• 0.12mm ultra-thin stencil thickness for precise solder ball placement
• Made from high-quality stainless steel for durability and long life
• Precision laser-cut hole pattern for accurate reballing results
• Ensures perfect CPU alignment during soldering
• Helps reduce solder bridging and repair errors
• Excellent heat transfer for efficient soldering performance
• Suitable for iPhone motherboard CPU repair
• Reusable professional BGA stencil
• Ideal for micro-soldering and chip-level repair tasks

Technical Specifications