AMAOE Stencil-RF2

The AMAOE Stencil-RF2 is a premium BGA reballing stencil crafted for mobile device technicians and professional repair workshops. Designed from durable stainless steel with ultra-fine laser-cut holes, this stencil provides precise alignment for solder balls during IC reballing and chip-level repairs. Its high-accuracy design helps reduce solder bridging and ensures consistent results across repeated use, enhancing workflow efficiency and repair quality. Whether you’re replacing RF2-series power ICs or performing complex motherboard repairs, the AMAOE Stencil RF2 is a reliable and essential tool for any advanced repair kit.

Key Features:

• Precision laser-cut stainless steel design for accurate IC reballing
• Ensures uniform solder ball alignment on RF2-series IC pads
• Reduces solder bridging and repair errors
• Durable, heat-resistant material for repeated workshop use
• Improves solder paste placement accuracy
• Ideal for mobile RF power IC chip reballing
• Lightweight and easy to handle
• Reusable after cleaning
• Compatible with solder paste and hot-air reflow tools
• Suitable for professional techs and advanced DIY repairers

Technical Specifications:

• Brand: AMAOE
• Model: RF2
• Material: Premium stainless steel
• Application: IC/BGA reballing for mobile RF2 chips
• Thickness: Approx. 0.12–0.15 mm
• Precision Tolerance: ±0.01 mm
• Finish: Anti-rust metallic surface
• Reusable: Yes
• Weight: Approx. 10–20 g
• Package Includes: 1 × AMAOE Stencil-RF2