Amaoe GOP1 Stencil for CPU / IC BGA Reballing
The Amaoe GOP1 Stencil is a professional BGA reballing stencil designed for precise solder ball reformation on mobile CPU and IC chips during motherboard repair. This high-quality stencil helps technicians restore damaged or removed chips by accurately rebuilding the solder ball grid, ensuring stable connectivity and reliable device performance.
Manufactured using premium-grade stainless steel, the Amaoe GOP1 stencil provides excellent durability and heat resistance, making it ideal for frequent use in professional repair environments. Its high-precision laser-cut holes ensure perfect alignment with chip pads, allowing uniform solder ball placement and minimizing solder bridging.
With its ultra-thin design, the stencil sits perfectly over the chip surface, helping technicians perform accurate micro-soldering work with greater efficiency. Whether used for CPU reballing, IC repair, or motherboard maintenance, the Amaoe GOP1 stencil is a reliable tool for professional mobile repair technicians.
The Amaoe GOP1 stencil is an essential addition to any mobile repair toolkit, helping improve repair success rates while saving time during complex reballing procedures.
Key Features
- Professional BGA stencil for CPU and IC reballing
- High-precision laser-cut hole design
- Made from durable stainless steel material
- Ultra-thin structure for perfect chip alignment
- Heat resistant and suitable for repeated use
- Ensures accurate solder ball positioning
- Reduces solder bridging and misalignment
- Ideal for mobile motherboard repair
- Supports precise micro soldering work
- Reliable tool for professional technicians
Technical Specifications
- Product Name: Amaoe GOP1 Stencil
- Brand: Amaoe
- Model: GOP1
- Material: Stainless Steel
- Type: BGA Reballing Stencil
- Application: CPU / IC Chip Reballing
- Manufacturing Process: Precision Laser Cutting
- Design: Ultra-Thin Professional Stencil
- Usage: Mobile Phone Motherboard Repair
- Reusable: Yes












